The **ATS-18A-80-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight (optimized for vertical airflow) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance** | 7.21 °C/W (@ 100 LFM) to 1.74 °C/W (@ 800 LFM) | | **Thermal Interface Material (TIM)** | T412 (High performance pre-applied) | --- ### 2. Component Breakdown The part number `ATS-18A-80-C3-R0` follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS-18A**: The series identifier (Push-pin heat sink family). 2. **80**: Specific physical dimensions and fin configuration code. 3. **C3**: Indicates the **Blue Anodized** finish and specific thermal performance tier. 4. **R0**: Revision code. ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is critical for the electronic integrity of a system: * **Thermal Dissipation:** It uses a high surface-area-to-volume ratio to transfer heat from the semiconductor junction to the surrounding air. * **Mechanical Stability:** The push-pin mechanism provides consistent pressure across the chip surface, ensuring the Thermal Interface Material (TIM) works efficiently without damaging the silicon die. * **Airflow Optimization:** The straight fin design is intended for **cross-cut airflow**, meaning it works best when paired with system fans that drive air through the fins. --- ### 4. Application Use Case This specific size (30mm x 30mm) is commonly used for: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.