### ATS-18A-81-C2-R0: Technical Overview The **ATS-18A-81-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components, such as BGA (Ball Grid Array) chips, CPUs, or GPUs, where space and thermal resistance are critical factors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.40°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 14.03°C/W | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body (Fins) The device utilizes a **cross-cut fin design**. This allows for multidirectional airflow, making it highly effective in systems where the direction of the cooling fan's air might not be perfectly aligned with the sink. #### B. The pushPIN™ Attachment System Unlike adhesive tapes that can degrade over time, the **-R0** variant uses a mechanical **pushPIN™** system: * **Springs:** Provide precise pressure (Pre-assembled) to ensure optimal contact with the component. * **Plastic/Brass Pins:** Secure the sink to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. * **ATS-18A-81-C2-R0** typically comes pre-applied with **T766** thermal grease or a high-performance phase-change material to fill microscopic air gaps between the chip and the aluminum base. --- ### 3. Thermal Performance Metrics Thermal resistance is the measure of how much the device resists the flow of heat. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 3.88 | | 200 LFM (1.0 m/s) | 1.40 | | 400 LFM (2.0 m/s) | 0.94 | | 600 LFM (3.0 m/s) | 0.75 | --- ### 4. Application Use-Cases * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For industrial PCs where vibration resistance is needed (provided by the push-pins). * **Power Supplies:** Cooling MOSFETs or power regulators. ---