## Technical Specifications for ATS-18A-85-C3-R0 The **ATS-18A-85-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for high-density electronic cooling applications, such as CPUs, GPUs, and other power-intensive integrated circuits. ### 1. General Product Overview | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-85-C3-R0 | | **Category** | Thermal Management - Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | --- ### 2. Physical Dimensions & Thermal Performance This heat sink is designed for a specific square footprint, providing a balance between surface area and airflow resistance. * **Size:** 35mm x 35mm * **Height:** 10mm (Low Profile) * **Thermal Resistance:** * **@ 100 LFM:** 8.35 °C/W * **@ 200 LFM:** 4.75 °C/W * **@ 500 LFM:** 2.10 °C/W * **Fin Style:** Straight Fin (optimized for unidirectional airflow) --- ### 3. Component Details (Electronic/Mechanical Integration) While a heat sink is a passive component, its "electronic parts" context refers to how it interacts with the PCB and the silicon die: #### A. Attachment System (Push Pins) The unit uses **brass push pins** with a steel spring. This provides: * Consistent pressure across the component for optimal heat transfer. * Reliable mechanical fastening that survives vibration and shock. * Easy installation without the need for specialized tools. #### B. Thermal Interface Material (TIM) The **"C3"** in the part number indicates the specific TIM applied to the base: * **Material:** T766 (High performance) * **Function:** Fills microscopic air gaps between the heat sink base and the electronic component to lower thermal impedance. #### C. Mounting Hole Pattern This model is designed for specific hole spacing on the PCB. It typically requires two holes drilled into the board, providing a more secure fit than adhesive tapes. --- ### 4. Application Use Cases * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where height constraints are present. * **Power Electronics:** Voltage regulators and MOSFET arrays.