ATS-18A-87-C3-R0
AI

The **ATS-18A-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-density electronic cooling.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 13.30° C/W (Natural Convection) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
| **Fin Style** | Straight (maxiFLOW design) |
| **Thermal Interface Material** | T412 (Pre-applied) |
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### 2. Key Design Components
#### A. The Fin Geometry (maxiFLOW™)
Unlike standard extruded heat sinks, the maxiFLOW design features a flared fin structure. This increases the surface area while maintaining a low pressure drop, making it highly efficient for forced-air cooling environments (where a fan is blowing air across the component).
#### B. The pushPIN™ Attachment
The "18A" in the part number indicates the specific attachment mechanism. This system uses a spring-loaded pin that passes through pre-drilled holes in the PCB.
* **Benefits:** Ensures consistent pressure on the high-heat component (like a CPU or FPGA) and prevents the heat sink from shifting during vibration or shipping.
#### C. Thermal Interface Material (TIM)
The "C3" suffix indicates that the part comes with **T412** thermal tape or grease pre-applied to the base.
* **Function:** This fills the microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer.
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### 3. Application Use Cases
This part is typically used to cool mid-range electronic components that generate significant heat in a small footprint:
* **ASICs and FPGAs:** Used in networking hardware and telecommunications.
* **Power Supplies:** Cooling voltage regulators or power transistors.
* **Embedded Computing:** Industrial PCs where space is limited but thermal loads are high.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18A:** Specific series and attachment type.
* **87:** Profile/Size identifier.
* **C3:** Finish and Thermal Interface Material code.
* **R0:** Revision status.
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What are the advantages of pushPIN attachment over adhesive thermal tape?
- ⤷ How do I calculate the airflow requirements for this heat sink?
- ⤷ Is there a copper version of the ATS-18A-87 for higher heat dissipation?