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  • ATS-18A-87-C3-R0

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    The **ATS-18A-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-density electronic cooling. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 13.30° C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Style** | Straight (maxiFLOW design) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Design Components #### A. The Fin Geometry (maxiFLOW™) Unlike standard extruded heat sinks, the maxiFLOW design features a flared fin structure. This increases the surface area while maintaining a low pressure drop, making it highly efficient for forced-air cooling environments (where a fan is blowing air across the component). #### B. The pushPIN™ Attachment The "18A" in the part number indicates the specific attachment mechanism. This system uses a spring-loaded pin that passes through pre-drilled holes in the PCB. * **Benefits:** Ensures consistent pressure on the high-heat component (like a CPU or FPGA) and prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "C3" suffix indicates that the part comes with **T412** thermal tape or grease pre-applied to the base. * **Function:** This fills the microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ### 3. Application Use Cases This part is typically used to cool mid-range electronic components that generate significant heat in a small footprint: * **ASICs and FPGAs:** Used in networking hardware and telecommunications. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Computing:** Industrial PCs where space is limited but thermal loads are high. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18A:** Specific series and attachment type. * **87:** Profile/Size identifier. * **C3:** Finish and Thermal Interface Material code. * **R0:** Revision status.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN attachment over adhesive thermal tape?
    • ⤷ How do I calculate the airflow requirements for this heat sink?
    • ⤷ Is there a copper version of the ATS-18A-87 for higher heat dissipation?