The **ATS-18A-90-C2-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | Description | | :--- | :--- | :--- | | **Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for secure mounting | | **Dimensions** | 35mm x 35mm x 25mm | Standard footprint for mid-sized ICs | | **Thermal Resistance** | ~6.30°C/W (Unducted) | Efficiency at 100 LFM (Linear Feet per Minute) | --- ### 2. Physical Design Elements #### A. Fin Profile (Straight Fin) The **90-series** designation usually refers to a straight-fin design. This is optimized for high-performance airflow environments where air can be forced through the fins to carry heat away from the base. #### B. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures: - **Consistent Pressure:** Maintains optimal contact between the chip surface and the heat sink base. - **Reliability:** Resistant to vibrations and mechanical shocks. - **Ease of Assembly:** Features a pre-drilled hole pattern and a brass/plastic pin with a compression spring. --- ### 3. Material and Interface * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills microscopic air gaps between the component and the heat sink. * **AL6063 Alloy:** The aluminum grade used provides a balance between structural integrity and thermal transfer speed. --- ### 4. Thermal Performance Comparison *Thermal resistance decreases as airflow (LFM) increases.* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.30 | | 200 | 1.0 | 3.30 | | 300 | 1.5 | 2.40 | | 400 | 2.0 | 1.90 | --- ### Summary of Use Cases The **ATS-18A-90-C2-R0** is ideal for: 1. **Networking Equipment:** Routers and switches with dense PCB layouts. 2. **Industrial PCs:** Where longevity and vibration resistance are required. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators that generate significant localized heat.