The **ATS-18A-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.00°C/W (Unducted Flow @ 100 LFM) | | **Weight** | 12 grams | --- ### 2. Key Component Design The part consists of three primary elements that work together to maintain electronic stability: #### A. The Heat Sink Body (Fin Array) This part uses a **Straight Fin** design. - **Efficiency:** The 10mm low-profile height is ideal for tight spaces or 1U rack servers. - **Surface Area:** The aluminum fins increase the surface area in contact with air, allowing for faster heat transfer from the silicon die. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or complex brackets, this part uses a standardized push-pin mechanism. - **Spring Loading:** It features a brass or plastic pin with a high-performance compression spring. - **Uniform Pressure:** This ensures the heat sink is pressed firmly and evenly against the component, maximizing thermal transfer across the interface. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the unit comes with **pre-applied thermal interface material**. - This fills the microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) inside the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.00 | | 300 (1.5 m/s) | 5.95 | | 500 (2.5 m/s) | 3.50 | --- ### 4. Typical Applications * **Networking Gear:** Switches and routers where airflow is forced. * **Embedded Systems:** Industrial PCs with limited vertical clearance. * **Power Electronics:** Voltage regulators and high-speed memory modules.