ATS-18A-93-C2-R0
AI

The **ATS-18A-93-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Product Type** | Heatsink (Push-Pin Mount) |
| **Thermal Resistance** | 7.37°C/W (at 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (with Compression Springs) |
| **Dimensions** | 40mm x 40mm x 20mm |
| **Fin Style** | Straight (optimized for airflow) |
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### 2. Breakdown of the Component Parts
The assembly consists of three primary electronic/mechanical parts:
1. **The Heat Sink Body:**
* Made from **Aluminum 6063**, which provides high thermal conductivity.
* The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation cooling.
2. **Push-Pins:**
* These are usually made of plastic (Nylon) or brass. They are designed to fit into pre-drilled holes on a Printed Circuit Board (PCB).
3. **Compression Springs:**
* Located on the push-pins to provide a precise amount of **downward pressure**. This ensures constant contact between the heatsink base and the electronic chip, which is critical for heat transfer.
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### 3. Usage and Application
The ATS-18A-93-C2-R0 is typically used on high-heat electronic components such as:
* **CPUs/GPUs:** In embedded systems or industrial PCs.
* **FPGAs:** Field Programmable Gate Arrays that generate significant localized heat.
* **Telecommunications Gear:** Routers and switches requiring reliable passive cooling.
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### 4. Thermal Performance Comparison
Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases:
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (Natural)** | 7.37 |
| **200 (Forced)** | 3.63 |
| **400 (Forced)** | 2.36 |
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- ⤷
How does the push-pin mounting system compare to adhesive thermal tape?
- ⤷ What type of thermal interface material (TIM) is recommended for this heatsink?
- ⤷ Can this heatsink be used in high-vibration environments?