Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18B-04-C2-R0

  • AI
    The **ATS-18B-04-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling high-density electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance (Unducted)** | 11.58 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.58 °C/W @ 200 LFM | | **Weight** | ~40.5 grams | --- ## 2. Key Components & Construction The ATS-18B-04-C2-R0 is composed of several critical electronic-mechanical parts: ### A. The Heat Sink Body * **Material:** Extruded Aluminum (6063). This provides high thermal conductivity while remaining lightweight. * **Finish:** Blue Anodized. This is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. ### B. pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses a mechanical fastening system: * **Push Pins:** Made of durable brass or plastic, designed to lock into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These ensure a consistent "clamping force" (interface pressure), which is vital for maintaining thermal contact even during vibration or thermal expansion. ### C. Thermal Interface Material (TIM) * The "-R0" suffix typically indicates that the part comes with **pre-applied thermal interface material**. This fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ## 3. Performance Analysis The efficiency of this part is measured by its ability to dissipate heat under different airflow conditions (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.58 | | 200 | 1.0 | 6.45 | | 400 | 2.0 | 3.39 | | 600 | 3.0 | 2.50 | --- ## 4. Part Number Breakdown The nomenclature **ATS-18B-04-C2-R0** can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18:** Series/Designator for the specific fin pattern. * **B:** Material/Construction code. * **04:** Specific sizing/height variant. * **C2:** Refers to the thermal performance/color (Blue Anodized). * **R0:** Revision and packaging indicator (Standard).
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling performance of this part?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?