ATS-18B-04-C2-R0
AI

The **ATS-18B-04-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling high-density electronic components like CPUs, GPUs, and FPGAs.
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## 1. Technical Specifications
Below are the primary physical and thermal parameters for this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight Fin |
| **Dimensions** | 40mm x 40mm x 20mm |
| **Thermal Resistance (Unducted)** | 11.58 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.58 °C/W @ 200 LFM |
| **Weight** | ~40.5 grams |
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## 2. Key Components & Construction
The ATS-18B-04-C2-R0 is composed of several critical electronic-mechanical parts:
### A. The Heat Sink Body
* **Material:** Extruded Aluminum (6063). This provides high thermal conductivity while remaining lightweight.
* **Finish:** Blue Anodized. This is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer.
### B. pushPIN™ Attachment System
Instead of using messy adhesives or simple clips, this part uses a mechanical fastening system:
* **Push Pins:** Made of durable brass or plastic, designed to lock into pre-drilled holes on the Printed Circuit Board (PCB).
* **Compression Springs:** These ensure a consistent "clamping force" (interface pressure), which is vital for maintaining thermal contact even during vibration or thermal expansion.
### C. Thermal Interface Material (TIM)
* The "-R0" suffix typically indicates that the part comes with **pre-applied thermal interface material**. This fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer.
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## 3. Performance Analysis
The efficiency of this part is measured by its ability to dissipate heat under different airflow conditions (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 11.58 |
| 200 | 1.0 | 6.45 |
| 400 | 2.0 | 3.39 |
| 600 | 3.0 | 2.50 |
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## 4. Part Number Breakdown
The nomenclature **ATS-18B-04-C2-R0** can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18:** Series/Designator for the specific fin pattern.
* **B:** Material/Construction code.
* **04:** Specific sizing/height variant.
* **C2:** Refers to the thermal performance/color (Blue Anodized).
* **R0:** Revision and packaging indicator (Standard).
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What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling performance of this part?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?