The **ATS-18B-06-C3-R0** is a high-performance thermal management component specifically designed for cooling electronic integrated circuits (ICs). It belongs to the **maxiFLOW™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications This part is a heat sink assembly that utilizes a high-performance "spread fin" design to maximize surface area for air convection. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.04°C/W (at 200 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (Off Base)** | 25.00mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Design and Functional Features #### A. Fin Geometry The "spread fin" design features a high aspect ratio. Unlike standard square fins, these are tapered and angled to increase the surface area available for heat dissipation while minimizing the pressure drop of the airflow passing through. #### B. pushPIN™ Attachment The part uses the **pushPIN™** system for mounting. This is critical for electronic stability because: * It provides a **constant pressure** across the chip surface. * It features a built-in spring to prevent over-tightening, which could crack a delicate silicon die. * It allows for quick installation and removal during prototyping. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, a high-performance thermal tape/pad. This fills the microscopic air gaps between the heat source (the CPU/FPGA) and the aluminum base, ensuring efficient heat transfer. --- ### 3. Common Applications This specific size and thermal profile are commonly found in: * **Networking Equipment:** Routers, switches, and high-speed gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecom:** Base station components and signal processing units. * **Power Supplies:** Cooling high-wattage MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-18B-06-C3-R0 varies based on airflow speed (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.04 | | 400 (2.0 m/s) | 1.19 | | 600 (3.0 m/s) | 0.94 |