The **ATS-18B-08-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heatsink** designed by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its technical specifications and physical properties. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18B-08-C3-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.71°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring compatibility with the PCB (Printed Circuit Board) layout and the component being cooled (such as a BGA chip or FPGA). * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height (Fin Height):** 15.00 mm * **Hole Spacing:** 33.00 mm (Center-to-Center) --- ### 3. Component Characteristics #### A. Fin Design (Fine Pitch) The "08" in the part number refers to the specific fin pattern. This model typically utilizes a **Fine Pitch** or **Straight Fin** design, which provides a high surface area to volume ratio, making it efficient for systems with directed airflow. #### B. Thermal Interface Material (TIM) The "C3" suffix indicates that this part comes pre-applied with a high-performance **Phase Change Material (PCM)** or thermal grease. This ensures low thermal resistance between the heat source and the aluminum base. #### C. Attachment System (Push-Pins) Unlike adhesive-based heatsinks, the ATS-18B series uses a mechanical push-pin system: * **Springs:** Provides constant pressure for better thermal contact. * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB. * **Reliability:** Resistant to shock and vibration compared to tape-on solutions. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.71 | | 300 | 1.5 | 5.83 | | 500 | 2.5 | 4.03 | | 700 | 3.5 | 3.30 | --- ### 5. Application Usage This part is commonly used for cooling: * **ASICs and FPGAs** in networking equipment. * **Processors** in embedded systems. * **Power components** on high-density PCBs.