The **ATS-18B-110-C2-R1** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Part Number** | ATS-18B-110 | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.72°C/W (at 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 25.00mm | --- ### 2. Physical Design Features * **Heat Sink Profile:** It utilizes a **Cross-Cut** fin design. This allows for multi-directional airflow, making it highly effective in compact enclosures where airflow direction might be unpredictable. * **Thermal Interface Material (TIM):** The "R1" suffix typically indicates that the part comes pre-applied with a high-performance thermal pad or phase-change material (usually **T766**), ensuring optimal heat transfer from the chip to the aluminum fins. * **Attachment Mechanism:** The `pushPIN™` system uses a flexible spring-loaded pin. This provides consistent pressure across the component surface, which is critical for maintaining a low thermal resistance interface. --- ### 3. Thermal Performance (Airflow) The efficiency of this heatsink depends heavily on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 2.72 | | **300 (1.5 m/s)** | 1.45 | | **500 (2.5 m/s)** | 1.15 | | **700 (3.5 m/s)** | 1.00 | --- ### 4. Part Number Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18**: Designates specific series/fin geometry. * **B**: Revision or specific material grade. * **110**: Internal size/height code. * **C2**: Indicates the specific push-pin hardware and spring type (usually a 4.7mm hole size). * **R1**: Specifies the thermal interface material and packaging.