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  • ATS-18B-115-C2-R0

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    The **ATS-18B-115-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "pushPIN™" line of thermal management products. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.33°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 20.00mm | | **ROHS Status** | Compliant | --- ### 2. Design and Components This part consists of three primary electronic-mechanical sub-components: * **The Heat Sink Body:** A block of aluminum extruded into a straight-fin design. This increases the surface area to allow heat to dissipate from the semiconductor (CPU/GPU/FPGA) into the surrounding air. * **The Attachment (pushPIN™):** Unlike adhesive tapes, this uses a brass or plastic pin with a high-tension spring. This ensures constant pressure (clamping force) between the heat sink and the electronic chip, which is vital for thermal efficiency. * **Thermal Interface Material (TIM):** The "-C2" suffix typically indicates that the part comes pre-applied with a thermal polymer or grease. This fills microscopic air gaps between the component and the heat sink. --- ### 3. Application in Electronics This component is used to prevent **thermal throttling** or hardware failure in: 1. **Telecommunications Equipment:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where airflow might be limited. 3. **Power Electronics:** Voltage regulators that generate significant heat during DC-to-DC conversion. --- ### 4. Thermal Performance Data Effective cooling depends on the velocity of air (measured in Linear Feet per Minute - LFM) passing through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.33 | | 300 (1.5 m/s) | 2.58 | | 500 (2.5 m/s) | 2.01 |
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to thermal adhesive tape?
    • ⤷ What is the importance of the Blue Anodized finish on this heat sink?
    • ⤷ Can this heat sink be used for a 45mm x 45mm chip?