ATS-18B-115-C2-R0
AI

The **ATS-18B-115-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "pushPIN™" line of thermal management products.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 5.33°C/W (at 100 LFM) |
| **Airflow Pattern** | Straight Fin |
| **Dimensions (L x W)** | 40.00mm x 40.00mm |
| **Height** | 20.00mm |
| **ROHS Status** | Compliant |
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### 2. Design and Components
This part consists of three primary electronic-mechanical sub-components:
* **The Heat Sink Body:** A block of aluminum extruded into a straight-fin design. This increases the surface area to allow heat to dissipate from the semiconductor (CPU/GPU/FPGA) into the surrounding air.
* **The Attachment (pushPIN™):** Unlike adhesive tapes, this uses a brass or plastic pin with a high-tension spring. This ensures constant pressure (clamping force) between the heat sink and the electronic chip, which is vital for thermal efficiency.
* **Thermal Interface Material (TIM):** The "-C2" suffix typically indicates that the part comes pre-applied with a thermal polymer or grease. This fills microscopic air gaps between the component and the heat sink.
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### 3. Application in Electronics
This component is used to prevent **thermal throttling** or hardware failure in:
1. **Telecommunications Equipment:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs where airflow might be limited.
3. **Power Electronics:** Voltage regulators that generate significant heat during DC-to-DC conversion.
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### 4. Thermal Performance Data
Effective cooling depends on the velocity of air (measured in Linear Feet per Minute - LFM) passing through the fins:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.33 |
| 300 (1.5 m/s) | 2.58 |
| 500 (2.5 m/s) | 2.01 |
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How does the pushPIN™ attachment compare to thermal adhesive tape?
- ⤷ What is the importance of the Blue Anodized finish on this heat sink?
- ⤷ Can this heat sink be used for a 45mm x 45mm chip?