The **ATS-18B-119-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Fine-Pitch (Straight) | | **Thermal Resistance (Unducted)** | 4.68 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.55 °C/W @ 100 LFM | --- ### 2. Breakdown of the Part Number To understand the specific features of this component, the part number can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18:** Series designation (indicates a specific push-pin hardware set). * **B:** Indicates the attachment hardware style (usually includes a spring for consistent pressure). * **119:** The unique identifier for the fin geometry and size. * **C2:** Refers to the material and finish (Aluminum with Blue Anodized coating). * **R0:** Revision code / RoHS compliance status. --- ### 3. Key Electronic/Mechanical Features 1. **High-Efficiency Heat Transfer:** The fine-pitch fin design maximizes surface area to dissipate heat into the surrounding air through convection. 2. **Pressure-Sensitive Mounting:** The push-pin mechanism uses a pre-assembled compression spring. This ensures that the heat sink maintains a specific, consistent pressure on the electronic component, which is critical for maximizing the effectiveness of the **Thermal Interface Material (TIM)**. 3. **Low Profile:** With a height of 20mm, it is suitable for dense electronic enclosures where vertical space is limited. 4. **Blue Anodized Coating:** This is not just aesthetic; anodizing increases the surface's emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 4. Typical Applications This heat sink is commonly used on: * **Field Programmable Gate Arrays (FPGAs)** * **Application-Specific Integrated Circuits (ASICs)** * **Power Modules** * **Embedded Computing Systems** ---