The **ATS-18B-130-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** line. This component is designed for thermal management in electronic systems, specifically for cooling Integrated Circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The part number encodes specific physical and material properties. Below are the primary specifications: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine-Pitch (Straight Fin) | | **Thermal Resistance (Flow)** | 5.23°C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.85°C/W | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | --- ### 2. Design and Construction The electronic and mechanical design focuses on maximizing heat dissipation within a compact footprint. * **Fin Profile:** It features a high-density, straight-fin design. This is optimized for airflow generated by system fans, allowing heat to transfer from the component base through the fins and into the ambient air. * **Base Material:** Made of aluminum, which provides a balance between high thermal conductivity and low weight (approx. 24 grams). * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes pre-applied with **T766** thermal phase-change material, ensuring a low-resistance thermal path between the chip and the heat sink. --- ### 3. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the ATS-18B-130-C2-R0 uses a mechanical attachment system: 1. **Spring-Loaded Bolts:** The assembly uses brass or plastic pins with stainless steel springs. 2. **Consistent Pressure:** The spring mechanism ensures a precise "Force-to-Fit," applying uniform pressure across the component surface to prevent air gaps. 3. **Reliability:** Mechanical fastening is preferred in high-vibration environments (like industrial servers) where adhesives might fail over time. --- ### 4. Application Use Cases This specific heat sink is typically used for: * **Processors (CPUs/GPUs):** Small form-factor embedded processors. * **FPGAs/ASICs:** High-speed logic gates that generate significant localized heat. * **Telecommunications:** Networking switches and routers where vertical space (15mm height) is restricted.