The **ATS-18B-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown of its specifications: | Parameter | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heatsink | | **Fin Type** | Straight Fin (Extruded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.60°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Key Electronic Functions This part serves as a passive cooling solution to maintain the "Junction Temperature" ($T_j$) of semiconductors within safe operating limits. * **Heat Dissipation:** It increases the surface area of the heat source, allowing ambient air to carry away heat via convection. * **Thermal Interface:** The "C2" suffix typically indicates a pre-applied high-performance thermal interface material (TIM), which fills microscopic air gaps between the component and the heatsink. * **Mechanical Stability:** The "Push-Pin" mechanism ensures consistent pressure across the chip surface, which is critical for uniform heat transfer. --- ### 3. Component Identification (Part Number Breakdown) Understanding the "ATS" nomenclature helps in identifying its specific application: 1. **ATS-18B**: The series designation (Standard Push-Pin Heatsink). 2. **131**: The specific footprint and fin configuration code. 3. **C2**: Indicates the specific Thermal Interface Material (TIM) and color (Blue). 4. **R0**: RoHS compliance status (lead-free and environmentally safe). --- ### 4. Typical Applications * **Processors (CPUs/GPUs):** Cooling mid-range embedded processors. * **FPGAs & ASICs:** Managing heat in high-speed networking or signal processing chips. * **Power Supplies:** Cooling voltage regulators or power transistors. ---