The **ATS-18B-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 70.00mm x 70.00mm x 10.00mm | | **Thermal Resistance** | 4.66 °C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### 2. Key Features and Components The ATS-18B-133-C2-R0 is engineered for specific airflow conditions and ease of assembly. #### A. Fin Design (Cross-Cut) This heat sink features a **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in dense electronic enclosures where air may not move in a perfectly straight path over the component. #### B. pushPIN™ Attachment System The part uses a specialized attachment mechanism: * **Ease of Install:** Allows for quick mounting to the PCB without complex brackets. * **Compression Springs:** Provides precise pressure on the electronic component, ensuring optimal contact with the thermal interface material (TIM). #### C. Thermal Interface Material (TIM) The model comes pre-applied with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal impedance. --- ### 3. Application Use Cases * **Embedded Systems:** High-performance ARM processors or FPGAs. * **Telecommunications:** Network switches and routers where vertical space is limited (low profile 10mm height). * **Power Supplies:** Cooling MOSFETs or power conversion chips. --- ### 4. Thermal Performance Comparison The performance of this heat sink varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.66 | | 300 | 1.5 | 2.10 | | 500 | 2.5 | 1.63 | ---