The **ATS-18B-14-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series and is categorized as a high-performance **Heat Sink**. --- ## 1. Component Overview This part is a passive heat exchanger designed to dissipate heat from an electronic component (such as a BGA, CPU, or FPGA) into the surrounding air. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-14-C2-R0 | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Heat Sinks | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | --- ## 2. Technical Specifications The part number itself contains encoded information regarding its size, material, and thermal properties. ### Physical Dimensions * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height (Fin Depth):** 20.00 mm * **Fin Pitch:** High-performance spread fin pattern. ### Thermal Performance Thermal resistance measures how effectively the part moves heat away from the device. * **Thermal Resistance (@ 200 LFM):** ~2.23 °C/W * **Thermal Resistance (@ 500 LFM):** ~1.15 °C/W * *Note: Performance improves as airflow (LFM) increases.* ### Material and Finish * **Material:** Aluminum (high thermal conductivity). * **Finish:** Blue Anodized. * **Thermal Interface Material (TIM):** T766 (pre-applied phase change material). --- ## 3. Key Electronic Design Features ### pushPIN™ Attachment Unlike simple adhesive heat sinks, this part uses the **pushPIN™** system. This consists of: 1. **Flexible Springs:** Provide precise pressure (load) on the component to ensure optimal thermal contact. 2. **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. ### Thermal Interface Material (T766) The "C2" in the part number indicates the specific thermal interface material. **T766** is a high-performance material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. ### Flow Dynamics The **maxiFLOW™** design features a graduated fin pattern. This reduces pressure drop and increases the surface area exposed to airflow, making it ideal for high-density electronic enclosures. ---