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  • ATS-18B-141-C2-R0

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    The **ATS-18B-141-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling electronic integrated circuits (ICs) and other surface-mount components. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push pin" attachment series. --- ### ## 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance (Flowing Air)** | 2.50 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 15.66 °C/W | | **Dimensions (L x W x H)** | 30mm x 30mm x 10mm | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### ## 2. Detailed Electronic Functionality While the part itself is passive (it does not contain circuits), its "electronic" role is critical for the stability of active components: * **Heat Dissipation:** It increases the surface area of a hot electronic component (like a CPU, FPGA, or Power MOSFET), allowing air to carry away heat more efficiently. * **Thermal Interface:** It is designed to be used with a **Thermal Interface Material (TIM)**, such as a phase-change pad or thermal grease, to bridge the microscopic air gaps between the chip and the aluminum base. * **Acoustic/Airflow Efficiency:** The straight fin design is optimized for environments with a defined airflow direction, minimizing pressure drop while maximizing heat transfer. --- ### ## 3. Breakdown of Part Numbering Understanding the ATS nomenclature helps in identifying the specific version: 1. **ATS-18**: Refers to the specific series of push-pin heat sinks. 2. **B**: Indicates the specific revision or material batch. 3. **141**: The size code (30mm x 30mm footprint). 4. **C2**: Refers to the **Blue Anodized** finish (which provides corrosion resistance and slightly improved emissivity). 5. **R0**: Indicates the version of the assembly (Standard revision). --- ### ## 4. Installation and Mounting The "Push Pin" system is a standard electronic assembly method: * **Pre-drilled Holes:** The PCB must have two holes at a specific distance (24mm apart for this model). * **Spring-Loaded Pressure:** The brass push pins use a compression spring to apply consistent downward force, ensuring the heat sink stays in contact with the electronic component even under mechanical vibration.
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material for this heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ What are the PCB hole diameter requirements for the brass push pins?