The **ATS-18B-147-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18B-147-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 2.50 °C/W @ 200 LFM (Linear Feet per Minute) | | **Shape** | Square / Rectangular with Tapered Fins | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits the PCB layout and the component it is intended to cool. | Dimension | Value (mm) | | :--- | :--- | | **Length** | 30.00 mm | | **Width** | 30.00 mm | | **Height** | 10.00 mm | | **Fin Pitch** | maxiFLOW™ High-density | --- ### 3. Core Electronic & Design Features * **maxiFLOW™ Geometry:** The fins are tapered and spread out. This design reduces pressure drop and increases the surface area exposed to airflow, making it highly efficient for forced-air cooling systems. * **pushPIN™ Mounting:** This part utilizes a specialized attachment system consisting of a spring and a pin. This ensures consistent pressure (clamping force) between the heat sink and the chip, which is vital for optimal heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** The "R0" suffix often indicates that the unit comes with a pre-applied high-performance thermal pad (specifically **T766**), eliminating the need for manual application of thermal paste. * **C3 Classification:** This indicates the specific spring and pin tension grade used to prevent damage to delicate surface-mount components while maintaining firm contact. --- ### 4. Application Use Cases This specific part is generally used in: 1. **Networking Hardware:** Switches and routers where airflow is directional. 2. **Embedded Systems:** Industrial PCs with limited vertical clearance (only 10mm high). 3. **Power Electronics:** Cooling MOSFETs or voltage regulators in high-density power modules.