ATS-18B-156-C2-R0
AI

The **ATS-18B-156-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-PIN" series, designed primarily for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific part number:
| Specification | Details |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Attachment Type** | Push-PIN (Plastic) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 4.14°C/W (at 200 LFM) |
| **Spring Type** | Compression Spring |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **18B**: Series identifier (typically relates to fin height and base thickness).
3. **156**: Specific profile dimensions (length/width).
4. **C2**: Finish/Material code (Blue Anodized Aluminum).
5. **R0**: RoHS compliance and revision status.
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### 3. Key Electronic Functions
While the heat sink itself is passive, its role in an electronic circuit is critical:
* **Thermal Dissipation:** It increases the surface area of the component (e.g., a power transistor or processor), allowing heat to escape more efficiently into the surrounding air.
* **Performance Stability:** By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents "thermal throttling," where a device slows its clock speed to protect itself from heat damage.
* **Longevity:** Excessive heat is the primary cause of electronic failure; this part ensures the component stays within its Safe Operating Area (SOA).
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### 4. Mounting Mechanism
The **Push-PIN** system is a significant feature of this part:
- It uses pre-drilled holes in the PCB.
- The pins are spring-loaded, ensuring **consistent pressure** across the Thermal Interface Material (TIM).
- This prevents the heat sink from shifting during vibration or mechanical shock, which is vital for industrial and aerospace applications.
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What are the recommended thermal interface materials for this heat sink?
- ⤷ How does the air flow (LFM) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used with a fan for active cooling?