Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18B-156-C2-R0

  • AI
    The **ATS-18B-156-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-PIN" series, designed primarily for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Type** | Push-PIN (Plastic) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.14°C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **18B**: Series identifier (typically relates to fin height and base thickness). 3. **156**: Specific profile dimensions (length/width). 4. **C2**: Finish/Material code (Blue Anodized Aluminum). 5. **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While the heat sink itself is passive, its role in an electronic circuit is critical: * **Thermal Dissipation:** It increases the surface area of the component (e.g., a power transistor or processor), allowing heat to escape more efficiently into the surrounding air. * **Performance Stability:** By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents "thermal throttling," where a device slows its clock speed to protect itself from heat damage. * **Longevity:** Excessive heat is the primary cause of electronic failure; this part ensures the component stays within its Safe Operating Area (SOA). --- ### 4. Mounting Mechanism The **Push-PIN** system is a significant feature of this part: - It uses pre-drilled holes in the PCB. - The pins are spring-loaded, ensuring **consistent pressure** across the Thermal Interface Material (TIM). - This prevents the heat sink from shifting during vibration or mechanical shock, which is vital for industrial and aerospace applications.
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials for this heat sink?
    • ⤷ How does the air flow (LFM) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used with a fan for active cooling?