The **ATS-18B-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18B-164-C2-R0 | | **Series** | pushPIN™ | | **Thermal Resistance** | 6.62°C/W (at 1.0 m/s airflow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 33mm | | **Fin Type** | Fine Pitch (Square Pattern) | --- ### Key Features and Design #### 1. Heat Sink Material and Coating The device is made from high-grade **Aluminum**. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. #### 2. pushPIN™ Attachment System This specific model uses a **push-pin and spring** assembly for mounting. * **Ease of Installation:** It allows for a standardized, repeatable installation process. * **Compression:** The springs provide specific pressure to ensure optimal thermal interface material (TIM) contact between the heat sink and the chip. #### 3. Airflow Efficiency The "Square Pattern" or cross-cut fin design is engineered for **multi-directional airflow**. This means it performs well regardless of which direction the fan is blowing relative to the fins, making it versatile for crowded PCB layouts. --- ### Application Usage This part is typically found in the following electronic environments: * **Telecommunications:** Cooling networking chips and processors. * **Industrial PCs:** Cooling embedded systems where space is constrained but height (33mm) is available. * **Power Supplies:** Managing heat for MOSFETs or high-power voltage regulators. ---