The **ATS-18B-169-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18B-169-C2-R0 | | **Fin Type** | Push-Pin (Fine Pitch) | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 15.71°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint of the heat sink is critical for PCB layout planning. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 10.00 mm (Low profile) * **Fin Style:** Straight fin design for optimized airflow. --- ### 3. Electronic Components Analysis #### A. The Heat Sink Body The body is made of **Blue Anodized Aluminum**. Anodizing is not just for aesthetics; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance. * Electrical insulation to prevent short circuits if a component makes accidental contact. #### B. The Push-Pin Mechanism This part uses a **Push-Pin** attachment system. Unlike simple adhesive tapes, push-pins provide: * **Constant Pressure:** Ensures a tight interface between the heat sink and the electronic component (CPU/GPU/FPGA). * **Shock/Vibration Resistance:** Securely locks the heat sink to pre-drilled holes in the PCB. * **Reliability:** Prevents the heat sink from detaching over time due to thermal cycling. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal phase change material**. * This material fills the microscopic air gaps between the chip and the heat sink. * When the electronic part heats up, the T766 softens to provide maximum thermal conductivity. --- ### 4. Application Use Cases This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** Cooling small processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and IoT gateways. 3. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators.