The **ATS-18B-170-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Below is the breakdown of its specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm | | **Height** | 25mm | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (High Performance Phase Change) | | **Fin Style** | Straight Fin | --- ### 2. Thermal Performance This component is designed to dissipate heat from BGA (Ball Grid Array) chips or other surface-mount components. Thermal resistance is measured based on the airflow (LFM - Linear Feet per Minute): * **Unducted Flow (300 LFM):** ~5.5 °C/W * **Unducted Flow (500 LFM):** ~4.3 °C/W * **Unducted Flow (700 LFM):** ~3.8 °C/W --- ### 3. Electronic Design Considerations When integrating this part into a hardware design, the following electronic and mechanical factors are critical: #### A. The Mounting System (Push Pin) The **C2** in the part number indicates the specific push pin and spring assembly. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB. * **Pressure:** The spring provides consistent downward pressure on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM) while avoiding mechanical stress that could crack the silicon die. #### B. Thermal Interface Material (T766) The unit comes pre-applied with **T766**. In the electronics world, this is a "Phase Change Material" (PCM). * At room temperature, it is solid for easy handling. * When the electronic component heats up, the material softens/melts to fill microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. #### C. Electrical Isolation Because the heat sink is **Blue Anodized**, the surface has a thin oxide layer that provides a degree of electrical insulation. However, in sensitive electronic designs, the heat sink is usually considered a "floating" conductive mass unless intentionally grounded to the PCB plane to reduce EMI (Electromagnetic Interference). --- ### 4. Typical Applications * **Processors:** Small CPUs, DSPs, or FPGAs. * **Telecommunications:** Network switches and routers. * **Industrial Electronics:** Motor controllers and power supply modules.