The **ATS-18B-173-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows the standard Advanced Thermal Solutions (ATS) nomenclature, detailing its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimension (Length x Width)** | 30.00mm x 30.00mm | | **Height** | 30.00mm | | **Thermal Resistance** | ~4.72°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Design Breakdown #### **A. Material and Finish** * **Aluminum AL6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** The blue surface finish is not just aesthetic; it provides increased corrosion resistance and slightly improves radiative heat transfer. #### **B. Geometry (Cross-Cut Fin Design)** * The heat sink features a **cross-cut** or "pinned" fin pattern. Unlike straight fins, this allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of which direction the cooling fan is blowing. #### **C. Mounting System (Push-Pins)** * **Brass Push-Pins:** The part uses two brass pins with integrated springs. * **Compression Springs:** These ensure consistent "TIM" (Thermal Interface Material) pressure against the component, preventing air gaps and maximizing heat transfer. * **Standard Hole Pattern:** Designed for pre-drilled holes in the PCB at specific intervals (usually 20.00mm or similar for this size). --- ### 3. Electronic Application This part is commonly found in the following electronic systems: 1. **Network Switches/Routers:** Cooling high-speed processors or ASICs. 2. **Embedded Systems:** Used on SoCs (System on Chips) that run at high clock speeds. 3. **Power Supplies:** Cooling MOSFETs or power regulators. 4. **FPGA Boards:** Providing thermal stability to Field Programmable Gate Arrays during heavy computation. --- ### 4. Thermal Performance Data *Approximate values based on airflow velocity:* * **@ 200 LFM (Linear Feet per Minute):** 4.72 °C/W * **@ 400 LFM:** 2.95 °C/W * **@ 600 LFM:** 2.41 °C/W ---