The **ATS-18B-177-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the "push pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass, 2-pin) | | **Spring Type** | Compression Spring (ATS-PPS-18) | | **Thermal Resistance** | 6.18°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Style** | Cross-Cut (Omni-directional) | --- ### 2. Breakdown of the Part Number The part number can be decoded to understand its specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18B**: Refers to the specific series/family of heat sinks. * **177**: Represents the specific dimensions and fin geometry profile. * **C2**: Indicates the material/finish (Blue Anodized Aluminum). * **R0**: Refers to the packaging and revision status. --- ### 3. Key Electronic Functions & Use Cases While it is a mechanical part, it is critical for the reliable operation of electronic systems: 1. **Thermal Dissipation**: It increases the surface area of a heat-generating component (like a BGA, CPU, or FPGA), allowing the ambient air to carry heat away more efficiently. 2. **Omni-directional Airflow**: The "cross-cut" fin design allows air to flow through the sink from any direction, making it ideal for enclosures where airflow patterns are unpredictable. 3. **Secure Mechanical Attachment**: The push-pin system ensures constant pressure between the heat sink and the chip, which is vital for effective heat transfer when used with Thermal Interface Material (TIM). --- ### 4. Installation Requirements To use this part effectively in an electronic design, the PCB must have: * Two pre-drilled holes spaced according to the 35mm footprint. * A Thermal Interface Material (TIM) such as thermal grease or a pad applied between the component and the heat sink base.