The **ATS-18B-196-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 45.00mm x 45.00mm | | **Height (Fin)** | 10.00mm | | **Thermal Resistance** | ~18.26°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This is critical for electronics because: * It ensures **constant pressure** across the component surface for maximum heat transfer. * It allows for **easy removal** during maintenance or board repair without damaging the silicon die. ### B. Material and Thermal Conductivity The unit is made of high-quality **Aluminum (AL6063)**. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased surface emissivity (better radiation heat transfer). * Corrosion resistance. * Electrical insulation to prevent short circuits if the sink accidentally touches nearby traces. ### C. Fin Design (Cross-Cut) The "18B" series typically features a **cross-cut fin pattern**. This design is optimized for "omni-directional" airflow, meaning it works effectively regardless of which way the cooling fan is blowing air across the PCB. --- ## 3. Application Use Cases This specific heat sink is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed ASICs. 2. **Embedded Systems:** For industrial PCs where space is limited (low 10mm profile). 3. **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs). --- ## 4. Part Number Breakdown The suffix `C3-R0` indicates specific kit configurations: * **C3:** Refers to the thermal interface material (TIM) pre-applied to the base (usually a high-performance thermal pad or grease). * **R0:** Indicates the revision and packaging standard.