The **ATS-18B-198-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Description | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Industry leader in thermal management. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance. | | **Thermal Resistance** | 9.06°C/W (Unducted) | Measures effectiveness at 200 LFM (linear feet per minute). | | **Attachment Method** | pushPIN™ | Uses a spring-loaded mechanism for secure mounting. | | **Dimensions** | 45mm x 45mm x 20mm | The physical footprint and height. | | **Fin Style** | Straight Fin | Optimized for linear airflow patterns. | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures consistent pressure between the heat sink and the electronic component. This improves the performance of the **Thermal Interface Material (TIM)** by eliminating air gaps. #### B. Material and Coating * **AL6063 Aluminum:** Chosen for its balance between thermal performance and cost. * **Blue Anodizing:** This is not just aesthetic; the anodized layer provides electrical insulation and improves the "radiative" heat transfer of the part. #### C. Thermal Performance Data The efficiency of this part varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 9.06 | | 400 (2.0 m/s) | 5.07 | | 600 (3.0 m/s) | 4.17 | --- ### 3. Typical Applications This specific model is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Industrial PCs:** Ensuring reliability in fanless or forced-air enclosures. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **Embedded Systems:** Used on SoCs (System on Chips) that generate significant heat under load. --- ### 4. Installation Example To use this part in a PCB design, the board must have pre-drilled holes to accommodate the push-pins. ```text PCB Mounting Layout: - Hole Diameter: 3.175 mm - Pitch: 38.0 mm (distance between pins) - Recommended TIM: Thermal Grease or Phase Change Material ``` ---