The **ATS-18B-199-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the device. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Standard Attachment) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.90°C/W (at 100 LFM) | | **Dimension (Length/Width)** | 50mm x 50mm | | **Height** | 6mm (Low Profile) | | **Fin Style** | Straight Fins | --- ## 2. Key Components & Design Features ### A. Fin Profile This model uses a **Straight Fin** design. * **Function:** Straight fins allow for high airflow efficiency when the air direction is predictable. * **Benefit:** The 6mm low-profile height makes it ideal for dense electronic enclosures or 1U server racks where vertical space is limited. ### B. Attachment Mechanism: Push-Pin The "18B" in the part number refers to the specific attachment style. * **Push-Pin:** It uses a spring-loaded plastic or brass pin that snaps into pre-drilled holes on the PCB. * **Compression:** The spring provides a constant pressure, ensuring the heat sink remains in firm contact with the component (Die/IHS), which is critical for thermal transfer. ### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with **T412** thermal tape or a similar interface pre-applied to the base. * **Purpose:** To fill microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18B** | Series/Attachment Type (Push-Pin) | | **199** | Specific Dimension/Fin Configuration | | **C3** | Thermal Interface Material (TIM) code | | **R0** | RoHS Compliant version | --- ## 4. Typical Applications * **Network Switches:** Cooling ASICs in shallow 1U chassis. * **Embedded Systems:** Industrial PCs where fans are small or airflow is restricted. * **Power Electronics:** Dissipating heat from VRMs or MOSFETs.