The **ATS-18B-201-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency for surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 8.17 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 40mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18B**: Series identifier (referencing the pushPIN™ attachment style). * **201**: Specific model/footprint configuration. * **C2**: Indicates the material and finish (usually Blue Anodized Aluminum). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Cooling Features * **maxiFLOW™ Design:** The sink features a spread fin structure. Unlike straight fins, these tapered fins increase the surface area and promote turbulence, which significantly improves heat dissipation in low-airflow environments. * **pushPIN™ Attachment:** This model uses a specialized attachment mechanism consisting of a brass or plastic pin and a compression spring. This ensures the correct pressure is applied to the electronic component (like a CPU, FPGA, or GPU) for optimal thermal transfer. * **T766 TIM:** It comes with a pre-applied Thermal Interface Material. This eliminates the need for manual application of thermal paste and ensures there are no air gaps between the chip and the heat sink. --- ### 4. Typical Applications This part is commonly used in industrial and high-reliability electronic systems, including: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Embedded Systems:** High-speed processors and SoCs. 3. **Power Supplies:** Managing heat in MOSFETs and power transistors.