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  • ATS-18B-21-C2-R0

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    ## Overview of ATS-18B-21-C2-R0 The **ATS-18B-21-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their "pushPIN™" series. This component is designed to dissipate heat from electronic devices, such as processors or power transistors, to prevent thermal throttling or damage. --- ### Technical Specifications | Parameter | Details | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Method** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 23.33 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 60.00mm x 60.00mm x 10.00mm | | **Pitch** | Fine Pitch | --- ### Key Components & Design Features #### 1. Thermal Interface Material (TIM) The "R0" suffix indicates that this model typically comes with **T766** pre-applied thermal interface material. This ensures optimal thermal contact between the heat source and the aluminum base. #### 2. Mechanical Attachment (Push Pins) Instead of adhesive or screw-down brackets, this part uses a **Push Pin** mechanism. * **Pins:** Brass or Plastic (depending on specific sub-variant). * **Springs:** Stainless steel springs provide precise pressure to ensure the heat sink remains seated during mechanical shock or vibration. #### 3. Fin Profile * **Pattern:** Cross-cut (provides multi-directional airflow). * **Density:** Designed for low-profile applications where vertical space is limited (only 10mm high). --- ### Applications * **Telecommunications:** Cooling for line cards and networking switches. * **Embedded Systems:** Industrial PCs and compact motherboards. * **Power Electronics:** Voltage regulators and high-speed memory modules. --- ### Ordering Code Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18B:** Specific series/form factor identifier. * **21:** Unique design/geometry code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Thermal Interface Material / Revision status.
    ✨ Follow-up Questions
    • ⤷ What are the differences between the C2 and C1 finish options for this heat sink?
    • ⤷ Can this heat sink be used with both plastic and brass push pins?
    • ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
    • ⤷ 500 LFM)?