ATS-18B-21-C2-R0
AI

## Overview of ATS-18B-21-C2-R0
The **ATS-18B-21-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their "pushPIN™" series. This component is designed to dissipate heat from electronic devices, such as processors or power transistors, to prevent thermal throttling or damage.
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### Technical Specifications
| Parameter | Details |
| :--- | :--- |
| **Product Type** | Heat Sink |
| **Series** | pushPIN™ |
| **Attachment Method** | Push Pin (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 23.33 °C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 60.00mm x 60.00mm x 10.00mm |
| **Pitch** | Fine Pitch |
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### Key Components & Design Features
#### 1. Thermal Interface Material (TIM)
The "R0" suffix indicates that this model typically comes with **T766** pre-applied thermal interface material. This ensures optimal thermal contact between the heat source and the aluminum base.
#### 2. Mechanical Attachment (Push Pins)
Instead of adhesive or screw-down brackets, this part uses a **Push Pin** mechanism.
* **Pins:** Brass or Plastic (depending on specific sub-variant).
* **Springs:** Stainless steel springs provide precise pressure to ensure the heat sink remains seated during mechanical shock or vibration.
#### 3. Fin Profile
* **Pattern:** Cross-cut (provides multi-directional airflow).
* **Density:** Designed for low-profile applications where vertical space is limited (only 10mm high).
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### Applications
* **Telecommunications:** Cooling for line cards and networking switches.
* **Embedded Systems:** Industrial PCs and compact motherboards.
* **Power Electronics:** Voltage regulators and high-speed memory modules.
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### Ordering Code Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **18B:** Specific series/form factor identifier.
* **21:** Unique design/geometry code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Thermal Interface Material / Revision status.
- ⤷
What are the differences between the C2 and C1 finish options for this heat sink?
- ⤷ Can this heat sink be used with both plastic and brass push pins?
- ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
- ⤷ 500 LFM)?