The **ATS-18B-27-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components such as processors, FPGAs, and ASICs. Below is the detailed technical breakdown of this part. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-27-C3-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.28°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Thermal Interface Material (TIM)** | T412 | | **Flow Direction** | Directional / Flared Fin | --- ## 2. Key Electronic Components Breakdown ### A. The Heat Sink Geometry (maxiFLOW™) This part features a **flared fin design**. Unlike standard straight-fin heat sinks, the fins spread outward. This maximizes the surface area for radiant cooling and increases air turbulence, which significantly improves thermal performance in forced-air environments (fans). ### B. The Attachment Mechanism (pushPIN™) The "18B" in the part number indicates the specific attachment hardware. * **Push Pins:** Uses a spring-loaded mechanism to provide precise pressure on the electronic chip. * **Uniform Pressure:** This ensures that the heat sink remains in flat contact with the component, preventing air gaps that cause overheating. * **Reliability:** It is designed to meet industry standards for shock and vibration (MIL-STD-810). ### C. Thermal Interface Material (T412) The suffix **C3** refers to the pre-applied thermal interface material (TIM). * **Function:** This is a conductive material (often a pad or grease) pre-applied to the base of the heat sink. * **Efficiency:** It fills microscopic air gaps between the chip surface and the heat sink base, ensuring maximum heat transfer. ### D. Finish (Blue Anodized) The **R0** indicates the revision and the finish. * **Purpose:** Anodizing is not just for color; it creates an oxide layer that increases surface emissivity and provides electrical insulation and corrosion resistance. --- ## 3. Application Use Cases This specific heat sink is typically used for large-surface-area components that generate significant heat but have limited vertical clearance (only 12.7mm high). * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFET arrays or power converters. ---