The **ATS-18B-28-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70mm x 70mm x 15mm | | **Thermal Resistance** | 2.91°C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Features The ATS-18B-28-C2-R0 is designed for versatility and efficiency in cooling high-power electronic components like CPUs, GPUs, or ASICs. ### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a spring-loaded pin mechanism. * **Reliability:** Ensures consistent pressure across the interface. * **Ease of Use:** Allows for quick installation and removal without messy glues. * **Stability:** Specifically designed to withstand high-vibration environments. ### B. Fin Design This part utilizes a **Straight Fin** geometry. This design is optimized for environments with high-velocity airflow (forced convection), allowing air to pass through the channels and carry heat away efficiently. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component and the heat sink, maximizing heat transfer. --- ## 3. Part Number Decoder Understanding the "ATS-18B-28-C2-R0" code: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18:** Series identifier. * **B:** Fin design/Style. * **28:** Specific footprint/size category. * **C2:** Blue Anodized finish. * **R0:** Revision code / Standard packaging. --- ## 4. Application Use Cases * **Network Switches:** Cooling processors in high-density rack equipment. * **Industrial Power Supplies:** Managing heat in voltage regulators. * **Embedded Computing:** Protecting SBCs (Single Board Computers) from thermal throttling.