The **ATS-18B-41-C1-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "pushPIN™" family, designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18B-41-C1-R0 | | **Heat Sink Type** | Push-Pin (XC-CUT) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 17.5mm | | **Fin Style** | Square Fin (XC-CUT) | | **Attachment Type** | Push-Pin (Plastic) | --- ### Key Electronic & Thermal Characteristics #### 1. Thermal Resistance This component is designed to dissipate heat efficiently away from a semiconductor. Thermal resistance varies based on airflow: * **Unducted Flow:** ~10.02 °C/W @ 100 LFM. * **Ducted Flow:** ~2.00 °C/W @ 200 LFM (Standard measurement). * *Note: Lower °C/W values indicate better cooling performance.* #### 2. Material & Finish * **AL6063 Aluminum:** Provides excellent thermal conductivity (approx. 200 W/m·K) while remaining lightweight. * **Blue Anodized:** This finish isn't just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 3. Attachment Mechanism (Push-Pin) The "18B" in the part number indicates the specific spring/pin combination. This mechanical attachment ensures: * **Consistent Pressure:** Provides uniform contact between the heat sink and the electronic chip. * **Easy Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### 4. Thermal Interface Material (TIM) The "C1" designation typically refers to the **ATS-PPS-18** attachment and often includes a pre-applied thermal interface material (like a phase-change material or high-performance thermal grease) on the base to fill microscopic air gaps between the heat sink and the chip. --- ### Applications * **Microprocessors:** Cooling CPUs in embedded systems. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules). * **Telecommunications:** Cooling FPGA or ASIC chips in networking gear.