The **ATS-18B-47-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-47-C3-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 2.30° C/W (at 200 LFM) | | **Pressure Drop** | 0.15 inH2O (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction * **Material:** The unit is made from high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides protection against corrosion and slightly increases emissivity for better radiative heat transfer. * **maxiFLOW™ Geometry:** The design features a tapered fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it efficient in forced-air environments (using fans). * **Attachment System:** It uses the **pushPIN™** system. This consists of a brass or plastic pin with a high-performance compression spring. This ensures a precise, secure, and repeatable mounting force on the chip, which is critical for maintaining contact with the thermal interface material (TIM). --- ### 3. Part Number Breakdown The suffixing in the part number provides specific manufacturing details: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18B:** Part of the 18 Series family. * **47:** Size/Height configuration. * **C3:** Specific thermal performance or density rating. * **R0:** RoHS compliant (lead-free and environmentally safe). --- ### 4. Application Use Cases This heat sink is typically found in: 1. **Networking Hardware:** Routers, switches, and base stations where high-speed processors generate significant heat. 2. **Embedded Computing:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Cooling MOSFETs or power ICs. ---