The **ATS-18B-52-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-18B-52-C3-R0 | | **Product Category** | Passive Cooling / Heat Sinks | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits onto the PCB without interfering with neighboring components. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height (Fin Depth):** 25.00 mm * **Pitch (Hole-to-Hole):** 40.00 mm (diagonal/spacing for mounting) --- ### 3. Thermal Performance Thermal resistance indicates how effectively the heat sink dissipates heat. Lower values (measured in °C/W) represent better cooling performance. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@ 100 LFM (0.5 m/s)** | 10.79 °C/W | | **@ 300 LFM (1.5 m/s)** | 4.39 °C/W | | **@ 500 LFM (2.5 m/s)** | 3.12 °C/W | | **@ 700 LFM (3.5 m/s)** | 2.56 °C/W | --- ### 4. Material and Construction * **Material:** Aluminum. * **Finish:** Blue Anodized (This provides corrosion resistance and increases surface emissivity). * **Fin Style:** Straight Fin (Designed for directional airflow). * **Thermal Interface Material (TIM):** T412 (Pre-applied phase change material or high-performance thermal tape/grease). --- ### 5. Technical Nomenclature Breakdown The part number can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18B:** Internal series/package size identifier. * **52:** Specific geometry/fin configuration. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision code. --- ### Key Applications * **Telecommunications:** Cooling of routers and switches. * **Embedded Systems:** High-speed processors in industrial PCs. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.