The **ATS-18B-55-C3-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The part number encodes specific dimensions and material properties. Below is a breakdown of its core characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Push-Pin Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass, 2-Piece) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Chomerics) | --- ### 2. Physical Design and Functionality The design focuses on maximizing surface area while maintaining a low profile for space-constrained PCB layouts. * **Straight Fin Design:** This architecture is optimized for **forced air cooling** (airflow from a fan). The gaps between the fins allow air to pass through linearly, stripping heat away from the aluminum surface. * **Thermal Interface Material (TIM):** The "T412" designation indicates a pre-applied phase-change material or adhesive tape. This fills microscopic air gaps between the chip and the heat sink to ensure maximum heat transfer. * **Push-Pin Mounting:** Unlike adhesive-only heat sinks, this part uses mechanical fasteners (Push-Pins). This provides consistent pressure across the chip surface and ensures the heat sink remains attached during high-vibration or high-shock environments. --- ### 3. Thermal Performance Data Performance is measured by thermal resistance ($^\circ C/W$). A lower number indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ C/W$) | | :--- | :--- | | **200 (1.0 m/s)** | 4.84 | | **300 (1.5 m/s)** | 3.43 | | **400 (2.0 m/s)** | 2.77 | | **600 (3.0 m/s)** | 2.08 | --- ### 4. Application Use Cases This specific model is typically used for cooling: * **BGA (Ball Grid Array) Chips:** Common in networking equipment. * **FPGAs & Microprocessors:** In industrial or telecommunications hardware. * **Power Management Units:** Where height is limited to 10mm.