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  • ATS-18B-57-C2-R0

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    The **ATS-18B-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application. --- ## 1. Technical Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for efficient cooling of electronic components like CPUs, GPUs, and ASICs. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18B-57-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.16°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions Precise measurements are critical for PCB layout and ensuring no interference with surrounding surface-mount devices (SMDs). | Dimension | Value (mm) | | :--- | :--- | | **Length (Base)** | 40.00 mm | | **Width (Base)** | 40.00 mm | | **Height (Fin Height)** | 15.00 mm | | **Hole Spacing** | 45.00 mm | --- ## 3. Key Features * **High Performance:** Uses a "Fine Pitch" or "Cross-Cut" design to maximize surface area for heat dissipation. * **Secure Attachment:** The pushPIN™ system uses a flexible spring mechanism that provides consistent pressure for maximum thermal transfer without damaging the PCB. * **T766 TIM:** Comes pre-applied with a high-performance thermal interface material, eliminating the need for manual thermal paste application. * **Lightweight:** The aluminum construction ensures high thermal conductivity while remaining light enough to avoid mechanical stress on the board. --- ## 4. Part Number Decoding (Breakdown) The part number follows the standard ATS nomenclature: * **ATS:** Manufacturer prefix. * **18:** Series identifier. * **B:** Material/Attachment variation. * **57:** Specific fin pattern or configuration. * **C2:** Thermal Interface Material (T766) and color (Blue). * **R0:** Revision code.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods to pushPIN for this heat sink?
    • ⤷ How does the ducted vs unducted thermal resistance compare for this part?
    • ⤷ Is this heat sink compatible with standard BGA components?