The **ATS-18B-63-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application. ### 1. General Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-18B-63-C1-R0 | | **Thermal Resistance** | 2.82°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Physical Dimensions Precision in dimensions is critical for PCB layout and ensuring no interference with nearby surface-mount devices (SMDs). | Dimension | Value | | :--- | :--- | | **Length / Width** | 40.00 mm x 40.00 mm | | **Height** | 20.00 mm | | **Pitch (Mounting)** | 45.00 mm | | **Weight** | ~40-50 grams (estimated) | --- ### 3. Thermal Performance Thermal resistance indicates how efficiently the part moves heat away from the silicon die. Lower values are better. * **Natural Convection:** 15.60°C/W (Still air) * **Forced Convection (200 LFM):** 1.57°C/W * **Forced Convection (500 LFM):** 1.02°C/W --- ### 4. Component Features & Technology * **Fine Pitch Fin Design:** The "63" series typically utilizes a straight-fin or cross-cut design optimized for high-density airflow. * **Push-Pin Attachment:** Unlike adhesive tapes, the push-pin mechanism provides consistent pressure (interface load), improving the effectiveness of the Thermal Interface Material (TIM). * **C1-R0 Suffix:** * **C1:** Indicates the thermal interface material (TIM) included (usually a high-performance pre-applied thermal pad). * **R0:** Refers to the revision code or specific packaging/compliance standard (RoHS compliant). ### 5. Application in Electronics This heatsink is typically found in: 1. **Networking Hardware:** Cooling CPUs in routers and switches. 2. **Embedded Systems:** High-power FPGA or SoC cooling. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. ---