The **ATS-18B-74-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 15.0mm | | **Thermal Resistance** | 8.80 °C/W @ 200 LFM | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ## Electronic & Physical Breakdown ### 1. Attachment Mechanism (Push-Pin) The "R0" suffix indicates the assembly includes a **brass/plastic push-pin** mechanism. These pins are spring-loaded, providing a consistent pressure (compression) against the semiconductor surface, which ensures optimal heat transfer without over-tightening. ### 2. Thermal Interface Material (TIM) This part comes pre-applied with **T412**. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance compared to dry mounting. ### 3. Cooling Performance (Thermal Resistance) The efficiency of the heat sink is measured by its ability to dissipate heat into the air: * **Natural Convection:** ~8.80 °C/W. * **Forced Air (Low Flow):** Performance improves significantly as air velocity (LFM) increases, making it suitable for server racks or fan-cooled enclosures. --- ## Naming Convention Analysis The part number follows the ATS internal coding system: | Part Segment | Meaning | | :--- | :--- | | **ATS-18B** | Series identifier (Push-Pin Aluminum) | | **74** | Specific fin geometry and dimensions | | **C3** | Finish (Blue Anodized) | | **R0** | RoHS Compliant and specific hardware version | --- ## Common Applications * **BGA Cooling:** Used for Ball Grid Array processors that generate moderate heat. * **Power Supplies:** Cooling voltage regulators (LDOs/Buck converters). * **Embedded Systems:** Ideal for space-constrained industrial PC boards.