The **ATS-18B-79-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows the specific nomenclature of the manufacturer, **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin Attachment) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 26.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Attachment Method** | Push-pin with Brass Springs | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number Understanding the alphanumeric code helps identify the specific variant: * **ATS-18**: Refers to the specific series of high-performance heatsinks. * **B**: Denotes the mounting style (Push-pin). * **79**: Represents the physical dimensions and fin configuration. * **C3**: Indicates the height and thermal performance tier. * **R0**: Refers to the packaging and revision (usually standard bulk/tray). --- ### 3. Key Electronic Components This part is composed of three main electronic cooling sub-elements: #### A. The Heatsink Body * **Design:** Uses an "extrusions" profile with high-density vertical fins. This increases the surface area for heat dissipation without occupying a large footprint on the PCB. * **Material:** Lightweight aluminum allows for quick thermal transfer from the component to the air. #### B. The Push-Pin Fastener * Instead of using adhesive tape (which can fail under high heat), this part uses **plastic push-pins** and **brass springs**. * **Benefit:** This ensures constant pressure between the heatsink and the electronic chip, maintaining a "tight" thermal contact even under mechanical vibration. #### C. Thermal Interface Material (TIM) * The **T412** material pre-applied to the bottom is a high-conductivity tape or grease. * **Function:** It fills microscopic air gaps between the chip surface and the heatsink base to maximize heat flow. --- ### 4. Application Use-Cases 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Power Supplies:** Managing heat in voltage regulators. 3. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.