The **ATS-18B-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-power electronic components like CPUs, GPUs, and ASICs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-80-C3-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Springs (Steel) | | **Thermal Resistance** | 1.92°C/W (at 200 LFM) | | **Overall Dimensions** | 36.83mm x 36.83mm | | **Height** | 25.00mm | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ## 2. Key Components & Construction ### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design uses a **tapered fin** structure. This geometry is engineered to maximize surface area while minimizing pressure drop. This is crucial in high-density electronic enclosures where airflow may be restricted. ### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN** system: * **Reliability:** Ensures consistent pressure between the heat sink and the electronic component (IC). * **Pre-Drilled Holes:** Requires specific hole patterns on the PCB for mounting. * **Spring-Loaded:** The compression springs provide a calculated force to ensure optimal thermal contact without damaging the chip. ### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the unit comes pre-applied with a **Phase Change Material** or high-performance thermal pad. This eliminates the need for manual application of thermal paste during assembly. --- ## 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the heat sink moves heat away from the component. Performance varies based on the airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 1.92 | | 1.5 m/s (300 LFM) | 1.50 | | 2.0 m/s (400 LFM) | 1.30 | | 3.0 m/s (600 LFM) | 1.05 | --- ## 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18B:** Specific series/form factor. * **80:** Pin and Spring configuration code. * **C3:** Material and Finish (Blue Anodized Aluminum). * **R0:** Thermal Interface Material (TIM) type and revision. ---