The **ATS-18B-82-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications This part belongs to the **maxiFLOW™** series, known for its high-efficiency thermal performance in limited airflow environments. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-82-C3-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Tapered / maxiFLOW™ | | **Thermal Resistance** | ~2.50 °C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits on the PCB without interfering with neighboring components. | Dimension | Measurement (mm) | | :--- | :--- | | **Length (L)** | 38.00 mm | | **Width (W)** | 38.00 mm | | **Height (H)** | 25.00 mm | | **Fin Depth** | 44.50 mm (External span) | --- ### 3. Key Electronic Functions & Features * **Heat Dissipation:** The primary function is to conduct heat away from a processor (BGA, FPGA, or CPU) and radiate it into the surrounding air. * **pushPIN™ Technology:** Uses a specialized attachment mechanism consisting of a brass or plastic pin and a stainless steel spring. This ensures consistent pressure on the electronic component for optimal thermal contact. * **Thermal Interface Material (TIM):** The "C3" designation indicates it comes pre-applied with **T412**, a high-quality thermal pad. This eliminates the need for manual application of thermal paste. * **Aero-Efficiency:** The tapered fin design (maxiFLOW™) is engineered to maximize surface area while minimizing pressure drop, allowing air to flow through the fins more effectively even at low speeds. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18B:** Series/Family identifier. * **82:** Specific dimensions and fin configuration. * **C3:** Specific Thermal Interface Material (T412). * **R0:** Revision code or packaging standard. ---