ATS-18B-85-C1-R0
AI

## ATS-18B-85-C1-R0 Technical Overview
The **ATS-18B-85-C1-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling electronic components such as processors, chipsets, and GPUs.
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### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Flowing)** | 22.90 °C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm |
| **Pitch / Fin Type** | Fine Pitch / Straight Fin |
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### 2. Component Analysis
#### A. The pushPIN™ Attachment System
This part utilizes a specific mounting mechanism that includes:
* **Brass Push Pins:** Designed to securely fasten the heat sink to the PCB.
* **Compression Springs:** These provide precise, even pressure across the interface to ensure maximum heat transfer without damaging the electronic component.
* **Compatibility:** Pre-drilled for specific hole patterns (20mm pitch for this model).
#### B. Thermal Interface Material (TIM)
The "R0" suffix indicates that the heat sink comes pre-applied with **ATS-PPS-01**, a high-quality thermal interface material. This eliminates the need for manual thermal paste application and ensures a consistent bond between the chip and the aluminum base.
#### C. Fin Geometry
* **Straight Fin Design:** Optimized for linear airflow.
* **Material (AL6063):** Chosen for its excellent thermal conductivity and lightweight properties.
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### 3. Thermal Performance (Deg C/W)
| Air Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow** | 22.90 | 13.60 | 9.00 | 7.00 | 5.90 |
| **Ducted Flow** | 8.20 | 5.40 | 4.60 | 4.10 | 3.80 |
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS-18** | Series Identifier |
| **B** | Material Code (Aluminum) |
| **85** | Specific Fin/Product Configuration |
| **C1** | Blue Anodized Finish |
| **R0** | Thermal Interface Material (ATS-PPS-01) Included |
- ⤷
What is the hole pattern spacing required on the PCB for this heat sink?
- ⤷ Can this heat sink be used with a fan for active cooling?
- ⤷ What are the advantages of the Blue Anodized finish over a plain finish?