## Overview of ATS-18B-85-C3-R0 The **ATS-18B-85-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 10mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~23.98 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Double-sided adhesive) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) The "85" in the part number indicates the specific fin pattern. Straight fin heat sinks are designed for **forced air cooling** (fans). The spacing allows for high airflow throughput while maintaining enough surface area to dissipate heat from the substrate. #### B. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-only heat sinks, this model uses a **brass push-pin** with a compression spring. * **Consistency:** The spring ensures constant pressure between the heat sink and the component, optimizing thermal transfer. * **Security:** It provides a mechanical lock to the PCB, making it resistant to vibration and shock. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**. This is a high-performance thermal tape that fills microscopic air gaps between the component surface and the aluminum base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific variations: * **ATS**: Manufacturer (Advanced Thermal Solutions) * **18B**: Series identifier (Push-pin type) * **85**: Fin geometry/profile code * **C3**: Size/Material/Finish code (Blue Anodized) * **R0**: Revision or specific packaging code --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Used on high-speed switching chips. * **Power Electronics:** Managing heat for voltage regulators and power modules.