The **ATS-18B-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### ## Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18B-88-C2-R0 | | **Heat Sink Type** | Push-Pin (Standard Attachment) | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | --- ### ### Core Electronic Components & Features The design of the ATS-18B-88-C2-R0 focuses on efficient heat dissipation for Surface Mount Technology (SMT) components like CPUs, GPUs, or power transistors. #### 1. Push-Pin Attachment Mechanism This part uses a specific **push-pin and spring assembly**. * **Purpose:** Provides a consistent, high-pressure contact between the heat sink and the electronic component. * **Advantage:** Prevents the heat sink from shifting during mechanical shock or vibration, ensuring constant thermal conductivity. #### 2. Material and Conductivity * **Aluminum Construction:** Offers a high thermal conductivity-to-weight ratio, which is essential for weight-sensitive PCB designs. * **Blue Anodized Coating:** This is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation cooling. #### 3. Thermal Performance (Airflow) The effectiveness of this part depends heavily on the linear feet per minute (LFM) of airflow within the electronic enclosure: * **Natural Convection:** ~10.0°C/W * **Forced Air (200 LFM):** ~6.67°C/W * **Forced Air (500 LFM):** ~3.50°C/W --- ### ### Physical Dimensions To ensure compatibility with an electronic PCB layout, the physical footprint is critical: | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Pin Pitch** | 43.00mm | --- ### ### Typical Applications This specific heat sink is commonly found in: * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PC:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers.