The **ATS-18C-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Pitch** | Fine Pitch | | **Thermal Resistance (Unducted)** | 10.70 °C/W @ 100 LFM | --- ## 2. Key Components & Construction ### A. The Heat Sink Body The core is made from **Aluminum 6063**, which is the industry standard for thermal conductivity and weight efficiency. The "Blue Anodized" finish isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. ### B. Fin Design (Straight Fin) The part uses a **Straight Fin** pattern. This is optimized for high-performance airflow environments where the air moves in a linear direction through the fins. ### C. Attachment Mechanism (pushPIN™) Instead of adhesive tapes which can fail over time, this part uses a mechanical **pushPIN™** system: * **Springs:** Provides consistent pressure (Pre-assembled with a high-performance spring). * **Pins:** Brass or Plastic pins that lock into pre-drilled holes on the PCB. * **Interface:** Usually paired with a **Thermal Interface Material (TIM)** or "chomerics" to bridge the gap between the chip and the metal. --- ## 3. Thermal Performance Profile Thermal resistance determines how effectively the part moves heat away from the electronic component. Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 10.70 °C/W | 4.88 °C/W | 3.48 °C/W | --- ## 4. Part Number Breakdown ```text ATS - 18 - C - 159 - C2 - R0 | | | | | | | | | | | └─ RoHS Version | | | | └─ Thermal Performance (C2 = High) | | | └─ Sequence/Model Number | | └─ Fin Attachment (C = pushPIN) | └─ Fin Count/Style └─ Manufacturer (Advanced Thermal Solutions) ```