The **ATS-18D-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 25.35°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Pitch (Hole Spacing)** | 33.00 mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | --- ### 2. Key Electronic Components & Design The "Electronic" functionality of this part is passive, focusing on heat transfer mechanisms: * **Heat Sink Base:** The 40x40mm aluminum base is designed to sit directly on the electronic component (CPU, FPGA, or MOSFET). * **Thermal Interface Material (TIM):** This specific model typically uses **T412**, a high-quality thermal tape or grease interface that ensures there are no air gaps between the chip and the heat sink. * **Fin Design:** It uses a high-density fin pattern to increase the surface area, allowing air from system fans to carry away heat more effectively. * **Push-Pin Mounting:** Unlike adhesive-only sinks, the push-pin system uses a brass component and a stainless steel spring to provide consistent pressure, ensuring reliable thermal contact even during mechanical vibration. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18** | Series Identifier | | **D** | Material/Attachment Style | | **01** | Specific Fin Design/Layout | | **C3** | Thermal Interface Material (T412) | | **R0** | RoHS Compliance and Revision | --- ### 4. Application Use-Cases This component is commonly found in the following electronic environments: * **Telecommunications:** Cooling of high-speed network processors. * **Embedded Systems:** Industrial PCs where space is limited (10mm height). * **Power Electronics:** Managing heat for voltage regulators and power converters.