The **ATS-18D-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 18.32°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 12.7mm | | **Fin Configuration** | Fine Pitch (maxiFLOW) | --- ### 2. Key Electronic Features #### A. Thermal Management Efficiency The "maxiFLOW" design features a high-density fin structure that increases the surface area for heat dissipation. In electronics, this prevents **thermal throttling** and extends the lifespan of semiconductor components by maintaining low junction temperatures. #### B. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high vibration or heat cycles, this part uses a mechanical **pushPIN™** system. * **Spring-loaded:** Ensures consistent pressure (clamping force) for optimal thermal interface material (TIM) performance. * **Reliability:** Ideal for high-vibration environments like industrial servers or telecommunications hardware. #### C. Material Properties * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Coating:** Provides corrosion resistance and electrical insulation properties to the surface of the sink. --- ### 3. Applications This specific heat sink is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Data Centers:** Managing thermals in rack-mounted server components. 3. **Industrial Controls:** Protecting processors in harsh environmental conditions. --- ### 4. Part Number Breakdown The nomenclature provides specific details about the component: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18D:** Series/Size family. * **02:** Specific height or configuration variant. * **C2:** Material/Finish code (typically refers to Blue Anodized). * **R0:** Revision or packaging code.