ATS-18D-03-C2-R0
AI

The **ATS-18D-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 100 LFM) |
| **Weight** | ~18.5 grams |
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## 2. Key Components & Features
### A. Push-Pin Mounting System
Unlike adhesive-based heat sinks, this model uses a **push-pin** mechanism.
- **Spring-Loaded:** Provides consistent pressure across the component surface for maximum heat transfer.
- **Reliability:** Pre-drilled holes in the PCB allow for a secure mechanical connection that is more resistant to shock and vibration than thermal tape.
### B. Fin Design
The ATS-18D-03-C2-R0 utilizes a **Fine Pitch** fin pattern.
- This increases the surface area available for convection.
- It is optimized for "High Velocity" airflows, commonly found in server racks or high-density electronic enclosures.
### C. Thermal Interface Material (TIM)
The "R0" designation typically implies the inclusion of a pre-applied **Thermal Interface Material**.
- This fills microscopic air gaps between the heat sink and the chip.
- It ensures efficient heat conduction immediately out of the box.
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## 3. Application Use Cases
This specific heat sink is commonly used for:
1. **Processors (CPUs/GPUs):** Small-form-factor embedded processors.
2. **ASICs & FPGAs:** Custom logic chips that generate localized high-temperature spots.
3. **Power Supplies:** Cooling voltage regulators or MOSFETs.
4. **Networking Gear:** Routers and switches where vertical clearance is limited (15mm height).
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## 4. Dimensional Drawing Summary
| Axis | Measurement |
| :--- | :--- |
| **Length (A)** | 40.00 mm |
| **Width (B)** | 40.00 mm |
| **Height (C)** | 15.00 mm |
| **Pitch (E)** | 33.00 mm (Distance between holes) |
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How do I calculate the required airflow (LFM) for this heat sink?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes for thermal performance?
- ⤷ Are there alternative mounting options if my PCB doesn't have push-pin holes?