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  • ATS-18D-03-C2-R0

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    The **ATS-18D-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~18.5 grams | --- ## 2. Key Components & Features ### A. Push-Pin Mounting System Unlike adhesive-based heat sinks, this model uses a **push-pin** mechanism. - **Spring-Loaded:** Provides consistent pressure across the component surface for maximum heat transfer. - **Reliability:** Pre-drilled holes in the PCB allow for a secure mechanical connection that is more resistant to shock and vibration than thermal tape. ### B. Fin Design The ATS-18D-03-C2-R0 utilizes a **Fine Pitch** fin pattern. - This increases the surface area available for convection. - It is optimized for "High Velocity" airflows, commonly found in server racks or high-density electronic enclosures. ### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a pre-applied **Thermal Interface Material**. - This fills microscopic air gaps between the heat sink and the chip. - It ensures efficient heat conduction immediately out of the box. --- ## 3. Application Use Cases This specific heat sink is commonly used for: 1. **Processors (CPUs/GPUs):** Small-form-factor embedded processors. 2. **ASICs & FPGAs:** Custom logic chips that generate localized high-temperature spots. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. 4. **Networking Gear:** Routers and switches where vertical clearance is limited (15mm height). --- ## 4. Dimensional Drawing Summary | Axis | Measurement | | :--- | :--- | | **Length (A)** | 40.00 mm | | **Width (B)** | 40.00 mm | | **Height (C)** | 15.00 mm | | **Pitch (E)** | 33.00 mm (Distance between holes) |
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes for thermal performance?
    • ⤷ Are there alternative mounting options if my PCB doesn't have push-pin holes?