The **ATS-18D-04-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling integrated circuits (ICs) and other PCB components. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 11.58 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.69 °C/W @ 400 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Pitch** | Fine Pitch | --- ### 2. Electronic Application & Usage This part is used in electronic systems to dissipate heat from power-hungry components. Common applications include: * **CPUs/GPUs:** Small form-factor processors. * **FPGAs & ASICs:** High-speed logic chips that generate significant heat. * **Power Supplies:** Regulators and converters. --- ### 3. Key Features 1. **High-Efficiency Fin Design:** The "Fine Pitch" fin pattern provides a large surface area for heat exchange while maintaining a compact footprint. 2. **PushPIN™ Mounting:** This features a pre-assembled spring-loaded mechanism. This ensures consistent pressure (TIM - Thermal Interface Material compression) on the chip, which is critical for efficient heat transfer. 3. **Material Science:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. 4. **Pre-applied TIM:** Usually comes with a high-performance thermal interface material (phase change or grease) to ensure no air gaps exist between the component and the heat sink. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18:** Series/Body style * **D:** Material/Feature code * **04:** specific footprint/fin configuration * **C2:** Thermal performance/TIM type * **R0:** Revision/Packaging code